Epoxy resin
for electronic applications

Epoxy resin - DYMAX Europe GmbH - for electronic applications
Epoxy resin - DYMAX Europe GmbH - for electronic applications
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Characteristics

Type
epoxy
Applications
for electronic applications

Description

Epoxy resins are made of tightly linked adhesive polymer structures that are often used in surface adhesives and coatings. Epoxy resins are capable of forming tight cross-linked polymer structures characterized by toughness, strong adhesion, and low shrinkage. Epoxy adhesives are nearly unmatched in heat and chemical resistance. When a two-part Crosslink® epoxy resin is mixed with the appropriate catalyst, the resulting reaction is exothermic, a chemical reaction that results in the release of heat. Crosslink and DYMAX epoxies are excellent for potting, casting, encapsulating, and a wide variety of structural bonding applications. * One-part and two-part epoxy resin systems * Electronic and structural applications * Bond metal, glass, plastics, and ceramics

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.