Vacuum laminating machine

The vacuum lamination process ensure a complete elimination of air from the surfaces of a printed circuit board, as well as perfect encapsulation of the traces. The machine has been developed for simultaneous application on both sides of the PCBs (flexible and rigid) in order to achieve high lamination quality and excellent conformation to fine patterns with dry film photoresist, dry film soldermask and ConforMASK dielectric film, copper foil for SBU technology and coverlayer application. The machine ensures a perfect adhesion of the dry film and that there are no air bubbles. The unit employs heat, vacuum and high pressure lamination and it is suitable for in-line or stand-alone mode operation. The machine is provided with a data management system to supervise and control the process parameters via an appropriate software.