Vacuum laminating machine MVC24 SERIES 2

for printed circuitsautomated

The Vacuum Laminator MVC24 Series 1 is a modular machine that can be operated in inline or stand alone operation. It has designed and built to eliminate encapsulation of air from the surfaces and perfect encapsulation of the traces of a printed circuit board, IC substrate, Semiconductors, solar cells. The machine can be selected to process single or double side; in order to achieve high lamination quality and excellent conformation to fine patterns with dry film photoresist, dry film soldermask, ConforMASK dielectric film, copper foil for SBU technology, coverlayer and many other film layup applications. The machine ensures a perfect adhesion of the film and eliminate air bubbles. Combination of heat, vacuum and high lamination pressure are utilised in the lamination cycle. The machine has data management system to control and record the process parameters via an latest technology of software & hardware.