Data connector microComp® Series
EthernetD-subrectangular

data connector
data connector
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Characteristics

Type
data
Format
Ethernet, D-sub
Shape
rectangular, straight
Electrical characteristics
high-density, high-speed
Material
aluminum, composite, shell
Domain
network
Other characteristics
miniature, high-speed, lightweight
Primary current

2.5 A

Operating temperature

Max.: 175 °C
(347 °F)

Min.: -55 °C
(-67 °F)

Description

•Optimized design and composite or aluminum shell for weight saving / 65% weight saving compared to standard HD D-Sub •Miniature solution for maximum space saving on panel / 35% size saving compared to standard HD D-Sub •Ease of use : removable & protected contacts, easy mating / unmating / 38 % easier than standard HD D-Sub with 33% more contacts •Non magnetic, non outgassing •ESCC 3401 QPL Miniature Space Grade microComp® Series is a QPL rectangular interconnect solution based on ESCC 3401 design. •Very High Density from 7 to 104 ways •#26 contacts, up to 2,5 A each •crimp & straight or 90° PC tail contacts •High speed network for Cat 5e Gigabit Ethernet 1000 base T links •QPL on ESCC 3401/081, 3401/082, 3401/083, 3401/084

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.