Epoxy resin ER2218

encapsulationfor electronic applicationslow-viscosity

Low Viscosity Flame Retardant Epoxy Resin ER2218 is a very low viscosity epoxy resin with excellent thermal stability. The product has been specifically designed for compatibility with reflow applications, therefore remaining stable for short term, high temperature excursions. ER2218 very low viscosity, flame retardant epoxy which has been formulated for use as a potting compound / encapsulation resin. Boasting excellent thermal stability ER2218 has been specifically designed for compatibility with reflow applications, therefore remaining stable for short term, high temperature excursions. The system utilises a hardener free of DDM or other aromatic amines and the flame retardant filler used is a non-halogenated ‘clean’ type leading to relatively low toxicity fumes and low smoke emission. Its extremely low viscosity makes it a perfect choice for potting electronics which have complex geometries or limited spacing. For more information please refer to the TDS, our technical support team are also on hand to discuss your application requirements further. Key properties Flame retardant, UL94 V-0 Excellent high temperature stability Withstands extreme temperatures for short periods of time, such as reflow applications RoSH compliant