CVD diamond Diafilm™ TM

Diafilm™ TM is a proven thermal management material ideal for high-power RF, optoelectronic and high-voltage power semiconductor devices. It reduces thermal gradients near a device, making heat sinks more efficient and allows high power devices to be used without increasing the system size or reducing the operating ambient temperature. Diafilm™ TM singulated heat spreaders can: • Lower device temperatures • Improve reliability • Expand performance capability Diafilm™ TM outperforms other commercially available heat spreader materials, with the highest known thermal conductivity of any solid material at room temperature. Advantages of Diafilm™ TM microwave CVD diamond heat spreaders • Highest thermal conductivity of any material • Electrically insulating • Five levels of thermal conductivity available • Range of sizes, thicknesses, and metalizations available • Broad range of die bonding solutions • Available in diameters up to 130 mm Going beyond today’s technical boundaries Diafilm™ TM’s superior thermal conductivity presents unprecedented reductions in junction temperature, while maintaining the same power level. This offers engineers the opportunity to create more economical and reliable systems. Modelling and analysing proposed solutions Our engineers and technologists use the latest computer modelling systems to model and analyse every aspect of the thermal and mechanical properties of a proposed application. We recommend and provide the optimal size, shape and thickness, and work with customers to most effectively integrate diamond into their applications.