Diafilm™ ETC700 CVD diamond heat spreaders are the first thermal management materials engineered to offer electrical conductivity alongside the exceptional thermal performance of diamond. This unique innovation from Element Six offers low dielectric and resistive losses, making it the ideal material for devices that demand optimal thermal management with minimal impact on electrical RF performance, such as high-power RF, optoelectronics andhigh-voltage semiconductors.
Outperforming metal-coated solutions
Diafilm™ ETC700 outperforms all other commercially available non-diamond heat spreader materials, such as metallized dielectrics.
• A high conduction cross-section enables better RF performance by improving the ground-plane isolation
• Reduces the slow wave mode and capacitive coupling between ground planes at low frequencies, maintaining a bulk thermal conductivity >700 W m-1 K-1
• Reduces conductive losses at higher frequencies
Proposed solutions to fit your applications
Our engineers and technologists analyse every aspect of the thermal and mechanical properties of a proposed application to recommend a diamond solution of the optimal size, shape and thickness, along with integration advice.
Element Six Diafilm™ heat spreaders have the highest known thermal conductivity of any solid material at room temperature. They are proven in the market as an ideal thermal management solution for high-power RF, optoelectronics and high-voltage power semiconductor devices.
Advantages of Diafilm™ ETC700
• High thermal conductivity
• Electrically conductive
• Excellent for minimizing capacitance coupling