Aluminum heatsink O123-100

power

Air Cooling Heatsinks O123-100 AS ENERGITM are used for single- and double-sided cooling of power semiconductor devices in disc design, with housing type PD21, PD22, PD23, PT21, PT21-1, PT23. The power dissipation of the cooler with natural cooling is 120 W. Heatsink contact surface diameter is Ø22 mm. Applied device housing: сontact surface Ø19-Ø22 mm, outside diameter Ø42 mm. Heatsink is used for cooling of power SCR thyristors and rectifier diodes for currents 100A - 500A. Airflow cooling can be natural or forced, depending on the amount of heat generated and the operating conditions of the semiconductors. Features: corrosion-resistant aluminum alloy; low thermal resistance; easy installation with a mounting slot; can be either standard models can also be customizing. Heat sinks are made of aluminum radiator profiles and do not require additional protective coating when used in different climatic conditions. Assembly of semiconductor devices (power diodes, thyristors) of tablet (disk) design with coolers is done by clamping bolts and traverse. The contact surfaces of the heatsink and power device must have low roughness and flatness deviations. For minimum electrical losses and maximum heat dissipation of the devices, the appropriate mounting force Fm specified in the power device specifications must be observed. Before mounting the contact surfaces of the heatsink, current contact and semiconductor device should be wiped with a cloth soaked in alcohol (toluene, benzene, acetone) and it is recommended to lubricate with a thin layer of silicone-organic heat transfer paste (this is a recommendation and is not a prerequisite for installation).