Data connector 401-51101-51SMTboard-to-boardparallel
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Characteristics
- Type
- data
- Format
- SMT, board-to-board
- Shape
- parallel
- Electrical characteristics
- insulation, high-density
- Material
- copper
- Other characteristics
- IEC, high-speed
- Primary current
0.5 A
- Voltage
50 V
- Pitch
0.5 mm
(0.02 in)- Data rate
10 Gb/s
- Operating temperature
Min.: -40 °C
(-40 °F)Max.: 125 °C
(257 °F)
Description
• for 5 mm board-to-board distance
• 220 contacts
• termination technology SMT
Specification - PICMG® COM.0 Rev 3.0
No. of Contacts - 220
Insulator Material - LCP, UL 94 V-0
CTI value
IEC 60112 - 175
Contact Material - Copper alloy
Plating - Au over Ni
Termination area - Au flash over Ni
Mating Force per Pin - max. 0.9 N
Separating Force per Pin - min. 0.1 N
Durability - 30 mating cycles
Coplanarity - max. 0.1 mm
Contact Resistance - max. 75 mΩ
Clearance and Creepage - ≥ 0.15 mm
Insulation Resistance - > 100 MΩ
Processing
Soldering Temperature - 260°C per J-STD-020
MSL - 1
Assembly - Pick and Place
Approval / Compliance
UL file - E130314
Environment - RoHS compliant
Catalogs
Connectors product catalog no. 27
377 Pages
COLIBRI®
16 Pages
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