• for all board-to-board distances
• 220 contacts
• termination technology SMT
• 0.76um Au
Insulator Material - LCP, UL 94 V-0
CTI value
IEC 60112 - 175
Contact Material - Copper alloy
Plating - 0.76µm Au over Ni
Termination area - Au flash over Ni
Mating Force per Pin - max. 0.9 N
Separating Force per Pin - min. 0.1 N
Coplanarity - max. 0.1 mm
Contact Resistance - max. 75 mΩ
Clearance and Creepage - ≥ 0.2 mm
Insulation Resistance - > 100 MΩ
Processing
Soldering Temperature - 260°C per J-STD-020
MSL - 1
Assembly - Pick and Place
Approval / Compliance
UL file - E130314
Environment - RoHS compliant