Data connector 404-52012-51
SMTboard-to-boardparallel

Data connector - 404-52012-51 - ept - SMT / board-to-board / parallel
Data connector - 404-52012-51 - ept - SMT / board-to-board / parallel
Data connector - 404-52012-51 - ept - SMT / board-to-board / parallel - image - 2
Add to favorites
Compare this product
 

Characteristics

Type
data
Format
SMT, board-to-board
Shape
parallel, low-profile
Connection type
female
Electrical characteristics
insulation, high-density
Material
copper
Other characteristics
IEC, rugged
Primary current

1.4 A

Pitch

1.27 mm
(0.05 in)

Operating temperature

Max.: 125 °C
(257 °F)

Min.: -55 °C
(-67 °F)

Description

Insulator Material - LCP, UL 94 V-0 CTI value IEC 60112 - 175 Contact Material - Copper alloy Plating - Au over PdNi over Ni Termination area - Sn over Ni Mating Force per Pin - ≤ 0.5 N Separating Force per Pin - ≥ 0.1 N Durability IEC 60512-9-1 - Performance level 1: 500 mating cycles Coplanarity - ≤ 0.1 mm Vibration, sinusoidal IEC 60512-6-4 - 10 - 2000 Hz, 20g Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5 - ≤ 1 µs Shock, semi-sinusoidal IEC 60512-6-3 - 50g, 11 ms Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5 - ≤ 1 µs Contact Resistance IEC 60512-2-1 - ≤ 25 mΩ Clearance and Creepage - min. 0.4 mm Insulation Resistance IEC 60512-3-1 - ≥ 10 GΩ
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.