Data connector 403-52012-51

wire-to-boardSMTparallel

• 12 pins • unmated stacking height: 1.75 mm • for board-to-board distances from 8.0 to 16.9 mm • SMT • Performance level 1 Insulator Material - LCP, UL 94 V-0 CTI value IEC 60112 - 175 Contact Material - Copper alloy Plating - Au over PdNi over Ni Termination area - Sn over Ni Mating Force per Pin - ≤ 0.5 N Separating Force per Pin - ≥ 0.1 N Durability IEC 60512-9-1 - Performance level 1: 500 mating cycles Coplanarity - ≤ 0.1 mm Vibration, sinusoidal IEC 60512-6-4 - 10 - 2000 Hz, 20g Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5 - ≤ 1 µs Shock, semi-sinusoidal IEC 60512-6-3 - 50g, 11 ms Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5 - ≤ 1 µs Contact Resistance IEC 60512-2-1 - ≤ 25 mΩ Clearance and Creepage - min. 0.4 mm Insulation Resistance IEC 60512-3-1 - ≥ 10 GΩ Processing Soldering Temperature JEDEC J-STD-020E - 20 - 40 s at 260°C MSL JEDEC J-STD-020E - 1 Assembly - Pick and Place Approval / Compliance UL file - E130314 Environment - RoHS compliant