• 20 pins
• without key
• for 1.60 mm edge card thickness
• Tape & Reel packaging
Insulator Material - LCP, UL 94 V-0
CTI value
IEC 60112 - 200
Contact Material - Copper alloy
Plating - Au over PdNi over Ni
Termination area - Sn over Ni
Mating Force per Pin - ≤ 0.635 N
Separating Force per Pin - ≥ 0.06 N
Durability
IEC 60512-9-1 - 500 mating cycles
Coplanarity - ≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4 - 10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5 - ≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3 - 50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5 - ≤ 1 µs
Contact Resistance
IEC 60512-2-1 - ≤ 15 mΩ
Clearance and Creepage - 0.25 mm
Insulation Resistance
IEC 60512-3-1 - ≥ 1 GΩ
Processing
Soldering Temperature
JEDEC J-STD-020E - 20 - 40 s at 260°C
MSL
JEDEC J-STD-020E - 1
Assembly - Pick and Place
Approval / Compliance
UL file - E130314
Environment - RoHS compliant