Data connector 401-55101-52

SMTboard-to-boardparallel

• for 8 mm board-to-board distance • 220 contacts • termination technology SMT • 0.76um Au Basics Specification - PICMG® COM.0 Rev 3.1 No. of Contacts - 220 Termination Technology - SMT Board-to-Board Distance - 8 mm Material Insulator Material - LCP, UL 94 V-0 CTI value IEC 60112 - 125 Contact Material - Copper alloy Plating - 0.76µm Au over Ni Termination area - Au flash over Ni Mating Force per Pin - max. 0.9 N Separating Force per Pin - min. 0.1 N Coplanarity - max. 0.1 mm Contact Resistance - max. 75 mΩ Clearance and Creepage - ≥ 0.15 mm Insulation Resistance - > 100 MΩ Processing Soldering Temperature - 260°C per J-STD-020 MSL - 1 Assembly - Pick and Place Approval / Compliance UL file - E130314 Environment - RoHS compliant