Data connector 405-53120-51

board-to-boardinsulationhigh-density

• 20 pins • unmated stacking height: 2.65 mm • EMC shielding • SMT • Performance level 1 Basics Performance Level IEC 60512-9-1:2010 - 1 No. of Contacts - 20 Termination Technology - SMT Board-to-Board Distance - 7.5 mm to 15.0 mm Material Insulator Material - LCP, UL 94 V-0 CTI value IEC 60112 - 150 Contact Material - Copper alloy Plating - Au over Ni Termination area - Sn over Ni Mating Force per Pin - ≤ 0.5 N Separating Force per Pin - ≤ 0.4 N Durability IEC 60512-9-1 - 500 mating cycles Coplanarity - ≤ 0.1 mm Vibration, sinusoidal IEC 60512-6-4 - 10 - 2000 Hz, 20g Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5 - ≤ 1 µs Shock, semi-sinusoidal IEC 60512-6-3 - 50g, 11 ms Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5 - ≤ 1 µs Contact Resistance IEC 60512-2-1 - ≤ 20 mΩ Clearance and Creepage - 0.25 mm Insulation Resistance IEC 60512-3-1 - > 5 GΩ Processing Soldering Temperature JEDEC J-STD-020E - 20 - 40 s at 260°C MSL JEDEC J-STD-020E - 1 Assembly - Pick and Place Approval / Compliance UL file - E130314 Environment - RoHS konform