• 52 pins
• right angled
• SMT
• 0.8 mm pitch
• Performance level 1
Performance Level
IEC 60512-9-1:2010 - 1
No. of Contacts - 52
Termination Technology - SMT
Operating Temperature Range - -55°C to + 125°C
Material
Insulator Material - LCP, UL 94 V-0
CTI value
IEC 60112 - 150
Contact Material - Copper alloy
Plating - Au over Ni
Termination area - Sn over Ni
Mechanical
Pitch - 0.8 mm
Mating Force per Pin - ≤ 0.5 N
Separating Force per Pin - ≤ 0.4 N
Durability
IEC 60512-9-1 - 500 mating cycles
Coplanarity - ≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4 - 10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5 - ≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3 - 50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5 - ≤ 1 µs
Electrical
Operational Current
IEC 60512-5-2 - 1.7 A at 20°C (80 of 80 pins)
5.5 A at 20°C (2 of 80 pins)
5.1 A at 20°C (4 of 80 pins)
16 A at 20°C (shield of 80 pins)
Contact Resistance
IEC 60512-2-1 - ≤ 20 mΩ
Clearance and Creepage - 0.25 mm
Insulation Resistance
IEC 60512-3-1 - > 5 GΩ
Test Voltage
IEC 60512-4-1 - 500 VAC
Data Transfer Rate - 16 Gbps
Processing
Soldering Temperature
JEDEC J-STD-020E - 20 - 40 s at 260°C
MSL
JEDEC J-STD-020E - 1
Assembly - Pick and Place
Approval / Compliance
UL file - E130314
Environment - RoHS konform