Data connector 401-55501-52SMTboard-to-boardparallel
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Characteristics
- Type
- data
- Format
- SMT, board-to-board
- Shape
- parallel
- Electrical characteristics
- insulation, high-density, high-speed
- Other characteristics
- IEC, rugged
- Primary current
0.5 A
- Voltage
50 V
- Pitch
0.5 mm
(0.02 in)- Data rate
10 Gb/s
- Operating temperature
Max.: 125 °C
(257 °F)Min.: -40 °C
(-40 °F)
Description
• for 8 mm board-to-board distance
• 440 contacts
• termination technology SMT
• 0.76um Au
Basics
Specification - PICMG® COM.0 Rev 3.1
No. of Contacts - 440
Termination Technology - SMT
Board-to-Board Distance - 8 mm
Material
Insulator Material - LCP, UL 94 V-0
CTI value
IEC 60112 - 125
Contact Material - Copper alloy
Plating - 0.76µm Au over Ni
Termination area - Au flash over Ni
Mating Force per Pin - max. 0.9 N
Separating Force per Pin - min. 0.1 N
Coplanarity - max. 0.1 mm
Contact Resistance - max. 75 mΩ
Clearance and Creepage - ≥ 0.15 mm
Insulation Resistance - > 100 MΩ
Processing
Soldering Temperature - 260°C per J-STD-020
MSL - 1
Assembly - Pick and Place
Approval / Compliance
UL file - E130314
Environment - RoHS compliant
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