Automatic stencil printer VERSAPRINT 2 ULTRA³

solder pasteSMTvacuum

The ULTRA³ model uses the latest measurement technology of the 3D LIST camera. The shape of the smallest solder paste depots plays a major role for the printed volume and ultimately for the shape of the solder joint. Is the paste deposit the same height over the entire surface or does it slope towards the edges? This question is answered by the ULTRA³, which combines a stencil printer and 3D SPI at the same time. Substrate handling and parallel process Clamping substrate between hold-down bar and transport belt Secure fixing of thin substrates without warping Minimal bounce and overlap of the substrate in the edge area Stencil bottom cleaning Parameter setting for wet, dry and vacuum cleaning With controlled paper feed for reproducible cleaning cycles and adapted material consumption Intelligent stencil cleaner Printhead and squeegee Closed loop control for reproducible printing results Optional weight compensation of squeegee and printhead enable low squeegee pressures Advantages VERSAPRINT 2 ULTRA³ stencil printer compared to 3D-SPI stand-alone 3D-SPI for inspection of complex boards directly after printing process Detect defects through stencil inspection before they occur Zero point measurement of unprinted PCB any time before printing Integrated closed-loop function for print offset End-to-end software platform for printing and inspection Maintenance and servicing for one machine, one contact for both processes Less space required in production line