Automatic rework station HR 600 3P

for BGAfor SMD

The Ersa Rework System HR 600/3P enables automatic repair of SMT components such as BGA and MLF up to edge lengths of 1 x 1 mm with precision and reliability. HRSoft 2´s graphical user interface enables effortless process selection and operation for any user. The Technology of Ersa Rework Systems sustainably secures the added value of electronics: gentle heating technology sensor guided soldering processes contactless residual solder removal precise component placement complete process documentation clear user guidanceg Specifications Rework System Ersa HR 600/3P Dimensions (WxDxH) in mm: 850 x 660 x 573 Weight in kg: 65 Anstistatic Design (y/n): yes Power Rating in W: 3.200 Nominal Voltage in V AC: 220 V - 240 VAC, 50-60 Hz, 16 A Top heating: hybrid radiator 800 W, in two zones, 60 x 60 mm Bottom heating: IR heater (3x 800 W), 380 x 250 mm Measuring channels: 3x K-type, 1x IRS Position laser: Class II PCB size in mm: up to 390 x 300 mm (+x), up to 535 x 300 mm (+x), (0HR600/3PL) PCB size in mm: 1 x 1 mm up to 60 x 60 mm Axis accuracy: up to +/- 25 µm Top placement camera: 5 MP GigE color camera Component camera bottom: 5 MP GigE black and white camera Working distance (typical): 30-60 mm to top heater, 35 mm to bottom heater Compressed air connection: 6-10 bar (oil-free). ¼ inch quick coupling Air volume cooling: approx. 105 l/min (@ 6 bar) Test symbol: CE Operating software: HRSoft 2 - suitable for Windows 8 and Windows 10 Reflow process camera: 10.7 MP, CMOS GigE color camera, 50 mm focal length, 2x LED illumination, adjustable