Camera inspection system ERSASCOPE M

opticalhigh-resolutioncomputer-controlled

Inspection systems for fast inspection of hidden solder joints Versatile. Designed for optical inspection and digital image acquisition - including measurement of solder joints on BGAs and other SMT components. The field of application includes visual inspection of components on PCBs in SMT or THT in general, but also visual inspection of LP areas or solder paste prints. ERSASCOPE tripod Dimensions (WxDxH) in mm: 500 x 520 x 400 Weight in kg: 5 Design: die-cast aluminum, Z-axis with quick/fine adjustment on fixture for ERSASCOPE inspection optics Version antistatic (y/n): yes Connections: Fiber optic light guide with LEMO connector for ERSASCOPE optics and 15 mm connector for light source, additional 1,000 mm gooseneck light guide for light brush, integrated USB 2.0 camera connection cable (USB-A/Mini-USB) Ersa MOBILE SCOPE basic unit Dimensions (LxWxH) in mm: 114 x 36 x 51 (without supply cable) Weight in g: 210 Principle: integrated optical system with built-in camera and LED light source Design: plastic, built-in lens 3 mm field of view, light controller integrated (light generation in optics) Light control: potentiometer (0-100%) Backlight characteristics: cold light LED illumination (option), separately hand-held, with light brush and light intensity adjustment Focus adjustment: integrated focus ring on optics Connections: USB 2.0 (USB-A, length 2.5 m), connection flange for MOBILE SCOPE optics Interchangeable optics 90° BGA module Design: integrated zoom optics, stereo illumination via built-in LED light source with plastic fiber optics, prismatic deflection optics 90°