Camera inspection system ERSASCOPE M plus XL

opticalfor quality controlBGA

Inspection systems for fast inspection of hidden solder joints on large printed circuit boards Versatile. Designed for optical inspection and digital image acquisition - including measurement of solder joints on BGAs and other SMT components. The field of application includes visual inspection of components on PCBs in SMT or THT in general, but also visual inspection of LP areas or solder paste prints. Ersa MOBILE SCOPE basic unit Dimensions (LxWxH) in mm: 114 x 36 x 51 (without supply cable) Weight in g: 210 Principle: integrated optical system with built-in camera and LED light source Design: plastic, built-in lens 3 mm field of view, light controller integrated (light generation in optics) Light control: potentiometer (0-100%) Backlight characteristics: cold light LED illumination (option), separately hand-held, with light brush and light intensity adjustment Focus adjustment: integrated focus ring on optics Connections: USB 2.0 (USB-A, length 2.5 m), connection flange for MOBILE SCOPE optics Interchangeable optics 90° BGA module Design: integrated zoom optics, stereo illumination via built-in LED light source with plastic fiber optics, prismatic deflection optics 90° Application: Inspection of hidden solder joints with gap dimensions from 50 to 1,500 µm (BGA, PLCC, QFP etc.) Total length in mm: 83 Weight in g: 60 Magnification: up to 15x - 180x (on 14" monitor) Footprint: 8.2 x 0.8 mm Focus range: 0.5-30 mm 80x MACROZOOM lens with LED Design: integrated zoom optics, built-in dimmable LED illumination, distance pin with three distance levels