Introducing METIS, a state-of-the-art hybrid planar mechanical/air bearing platform designed for step and scan applications, ensuring unparalleled accuracy, move & settle times and speed stability over 4 degrees of freedom.
The METIS platform is a cutting-edge hybrid planar mechanical/air bearing platform, dedicated to step and scan applications with four-axis movement in X, Y, Z, and Theta directions. Its dynamic flatness over the full travel range and bidirectional repeatability make it ideal for high-precision tasks. METIS is widely used in Wafer Process Control applications such as Critical Dimension and Thin Film Metrology, Wafer Scribing, and Wafer Laser Thermal Annealing. It is also suitable for Back End Of Line Lithography machines (mask aligners) and some wafer dicing applications.
METIS delivers reliable performance, making it an essential tool for advanced semiconductor and photonics applications.
Characteristics
METIS combines mechanical and air bearing technologies for ultimate precision and flexibility.
METIS enables movements in X, Y, Z, and Theta axes, ideal for step and scan applications.
The platform offers high dynamic flatness and high bidirectional repeatability over the entire travel range.
METIS is used in wafer process control, wafer scribing, and laser thermal annealing.
The platform delivers reliable performance for advanced semiconductor and photonics applications.
METIS is also suitable for back-end lithography machines and wafer dicing applications.
Here are the key features of our models:
Flatness of motion
Maintained by air bearing technology over the full travel range.