Manual cleaning system EVG®301

for the chemical industry

The EVG301 semi-automated single wafer cleaning system employs one cleaning station, which cleans wafers using standard DI-water rinse as well as megasonic, brush and diluted chemicals as additional cleaning options. With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures and 300 mm capability. The EVG301 system can be combined with EVG's wafer alignment and bonding systems to eliminate any particle prior to wafer bonding. Spinner chucks are available for different wafer and substrate sizes to allow easy setup for different processes. Features High-efficiency cleaning using 1 MHz megasonic nozzles or area transducers (option) Brush scrubbing for single-side cleaning (option) Diluted chemicals for wafer cleaning Prevents cross-contamination from back to front side Fully software controlled cleaning process Options Pre-bonding station with IR-inspection Tooling for non-SEMI standard substrates Technical Data Wafer diameter (substrate size) 200, 100 - 300 mm Cleaning system Open chamber, spinner and cleaning arm Chamber: made of PP or PFA (option) Cleaning media: DI-water (standard), other cleaning media (option) Spinner chuck: vacuum chuck (standard) and edge handling chuck (option) made of metal ion free and clean materials Rotation: up to 3000 rpm (in 5 sec)