Processing line for the food industry EVG®150

for wafers

The EVG®150 is a fully- automated resist processing system providing high-throughput peformance and supporting wafers up to 300 mm in diameter. Designed as a fully modular platform, the EVG150 allows automated spray/spin/develop processes and high-throughput performance. The EVG150 guarantees highly uniform coats and improved repeatability. Wafers with high topography can be uniformly coated by EVG’s OmniSpray technology, where traditional spin coating encounters limitations. Features Wafer sizes up to 300 mm Up to six process modules Customizable number - up to twenty bake/chill/vapor prime stacks Up to four FOUP load ports or cassette loading Available modules include Spin Coat, Spray Coat, NanoCoat™, Develop, Bake/Chill/Vapor/Prime EV Group’s proprietary OmniSpray® ultrasonic atomization technology provides unmatched process results when it comes to conformal coating of extreme topographies Optional NanoSpray™ module achieves conformal coating of 300-micron deep patterns with aspect ratios up to 1:10 and vertical sidewalls Extensive range of supported materials Bake modules for up to 250 °C Megasonic technology for cleaning, sono-chemical processing and developing improves process efficiency and lowers the process time from hours to minutes Sophisticated and field-proven robot handling with dual end-effector capability ensures continuous high throughput