Automated wafer bonder EVG®520 IS

The EVG520 IS single-chamber unit handles wafers up to 200 mm with semi-automated operation for small-volume-production applications. Redesigned based on customer feedback and EV Group's continuous technological innovations, the EVG520 IS features EV Group's proprietary symmetric rapid heating and cooling chuck design. Advantages such as independent top- and bottom-side heater, high-pressure-bonding capability, and the same material and process flexibility as on manual systems contribute to the success of all wafer bonding processes. Features Fully automated processing with manual loading and unloading including external cooling station Compatible with EVG mechanical and optical aligners Single- or double-chamber automated system Fully automated bond process execution and bond cover movements Integrated cooling station for high throughput Options: High vacuum capability (1E-6 mbar) Programmable mass flow controller Integrated cooling Technical Data Max Contact Force 10, 20, 60, 100 kN Heater size150 mm200 mm Minimum substrate dimensionsingle chips100 mm Vacuum Standard: 1E-5 mbar Optional: 1E-6 mbar