Rigid PCB, 8L, Impedance Controlled Board with Via in-PAD fill
Spec
8 Layers:FR4 TG175+/-5
Key Features
Board Thickness-1.6+/-0.16mm
Copper Thickness-B:H/H, F:1/1
Surface Finish-Immersion Gold 1u"
Solder Mask Color-Green
Remark-Impedance Control 50 OHM, 90 OHM&100 OHM(Differential Pair)