Key Features
*Layers: 12Layers
*Finished Board Thickness: 1.7+/-0.1mm
*Material:FR-4 High TG 170
*Surface Finish:Electroless Au/ Organic Solderability Preservatives
*Copper: H/H/H/H/1/1/1/1/H/H/H/H OZ
*Dielectric Layer: TG170 Prepreg
*Solder Mask: Green
* Remark: Blind Via: L1/L2& L2/L3&L9/L10&L11/L12
*Panel Size: 150mmX244mm