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Multilayer printed circuit board High TG 170

Multilayer printed circuit board - High TG 170 - ExPlus
Multilayer printed circuit board - High TG 170 - ExPlus
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multilayer

Description

6 Layer with HDI and Blind Routing Spec Thickness:1.6+/- 0.1mm Thickness:1.6 +/- 0.1mm Key Features 6 Layer Rigid PCB Thickness: 1.6 +/- 0.1mm Material:FR-4 (High TG 170) Surface Finish: Electroless Nickel/Immersion Gold Copper: H/1/1/1/1H OZ Dielectric Layer: TG170 Prepreg Solder Mask: Red ReMark: Blind Via: L1/L2&Blind CNC:L1/L4&L6/L3 Panel Size: 83mmX155mm
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.