Defect detection inspection system

cameraautomaticfor the packaging industry

For the mid stream wafer manufacturing enterprises and downstream packaging and testing enterprises in the semiconductor industry chain, a multi-channel bright and dark field parallel detection system developed independently is adopted to detect the appearance defects of semiconductor wafers and grains with graphics. Product advantages: • Available in a variety of sizes           This equipment can be used for 4-8 inch patterned wafers • Can detect a variety of defects           Detect defects such as scratch, back collapse, color difference, crack, scratch, metal residue and metal loss • High precision resolution           System resolution: 0.2-0.8 μ m • Fast detection speed           Patterned wafer: 15 minutes / wafer when the number of defects is less than 200