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Thickness measuring system opticalfor wafersfor industrial applications
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Characteristics
- Measured physical value
- thickness
- Technology
- optical
- Measured material
- for wafers
- Applications
- for industrial applications, for electronics
- Other characteristics
- high-precision, high-speed, 2-axis
Description
Facing the raw material production enterprises in the upstream of the semiconductor industry chain, the independently developed spectral confocal measurement system is used to detect the size and flatness of semiconductor raw and epitaxial wafers.
Product advantages:
Wide application range
Used for 4-8 inch original wafer, substrate and epitaxial wafer of various materials and polishing conditions
High measurement accuracy
Thickness range: 0-1mm measurement accuracy: ± 1 μ M repetition accuracy: 0.2 μ m
Short measurement time
Measurement time: 30s / PCS (according to the customer's detection trajectory)
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Specialized Products for Semiconductor Industry
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.