Laser cutting machine

for monocrystalline siliconwaferCNC

This equipment is used for laser modification and cutting of silicon-based wafers in the semiconductor industry for 8-inch and above chip sealing and testing plants. •High quality There is no damage on the surface, no cutting seam, and the edge collapse is very small (≤ 2 μ m) , the edge is small (< 3 μ m） •High efficiency Multi focus modification mode can be adopted to multiply the cutting efficiency •Good stability The laser has high average power stability (≤± 3% over 24 hours) and high beam quality (M ² < 1.5)