Rotary blade cutting machine
for ceramicsfor glassfor monocrystalline silicon

Rotary blade cutting machine - Farley Laserlab - for ceramics / for glass / for monocrystalline silicon
Rotary blade cutting machine - Farley Laserlab - for ceramics / for glass / for monocrystalline silicon
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Characteristics

Technology
rotary blade
Material
for monocrystalline silicon, for glass, for ceramics
Product handled
sheet
Control type
CNC
Applications
for the semiconductor industry
Other characteristics
automatic, high-precision, high-speed, with CCD camera
X travel

494 mm
(19.45 in)

Y travel

882 mm
(34.72 in)

Z travel

1,668 mm
(66 in)

Cutting speed

Min.: 0.1 m/s
(0.328 ft/s)

Max.: 800 m/s
(2,624.672 ft/s)

Repeatability

1 µm

Weight

500 kg
(1,102.31 lb)

Description

This equipment is mainly developed for semiconductor and 3C industries. Suitable for cutting silicon, ceramics, glass, SiC and other materials. It has the advantages of fast cutting speed and high positioning accuracy. The equipment is equipped with a high-precision CCD vision system, which can realize the automatic positioning and angle adjustment of the workpiece and improve the processing efficiency. • Small size The appearance size and the floor area are small, and the cutting stroke is large. • High efficiency High power spindle, high-speed and high-precision motor, closed-loop motion control to ensure production efficiency. • Complete detection Equipped with NCS, knife mark, edge collapse and cutting path position detection function •Fullly featured It is equipped with data management, alarm recording and log management functions. Applications: Semiconductor industry 3C industry

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.