Laser marking machine IC Substrate X-Out

for electronic componentsfor PCBhigh-speed

Used for automatic identification and laser marking scrap unit on carrier products, which facilitates efficient and accurate identification of subsequent processes and improves the product yield and process efficiency of customer factories. Product advantages: With the development of printed circuit boards towards refinement, high density and high performance, precision lasers are more and more widely used in the downstream industry of circuit boards because of their non-contact, stressless, and flexible processing characteristics. HGLASER PCB Microelectronics Division provides integrated solutions for the upstream and downstream industries of PCB such as laser cutting, marking, automation, and full-process traceability management. • Focus on laser applications in SMT factories, providing customers with automated production line solutions for laser coding, laser cutting and splitting + testing + automatic sorting + automatic packaging. • Focus on the application of FPC industry, providing customers with professional solutions for the core process of FPC cover film roll-to-roll cutting, FPC shape cutting, FPC high-speed drilling and other industries.