Laser marking machine IC

for electronic componentsfor PCBfor the microelectronics industry

Suitable for the packaged IC surface marking , automatic loading and unloading, automatic width adjustment, and the effect of the mark detection through OCR and the MES data analysis system and data feedback can improve the process yield and manufacturing efficiency. Product advantages: With the development of printed circuit boards towards refinement, high density and high performance, precision lasers are more and more widely used in the downstream industry of circuit boards because of their non-contact, stressless, and flexible processing characteristics. HGLASER PCB Microelectronics Division provides integrated solutions for the upstream and downstream industries of PCB such as laser cutting, marking, automation, and full-process traceability management. • Focus on laser applications in SMT factories, providing customers with automated production line solutions for laser coding, laser cutting and splitting + testing + automatic sorting + automatic packaging. • Focus on the application of FPC industry, providing customers with professional solutions for the core process of FPC cover film roll-to-roll cutting, FPC shape cutting, FPC high-speed drilling and other industries.