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Laser cutting machine LUD serieswaferfor processing industrywith automated loading
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Characteristics
- Technology
- laser
- Product handled
- wafer
- Applications
- for processing industry
- Workpiece loading
- with automated loading
- Phase
- single-phase
- Other characteristics
- automatic, high-precision, high-speed, high-efficiency
- X travel
200 mm
(7.87 in)- Y travel
300 mm
(11.81 in)- Repeatability
2 mm, 5 mm
(0.0787 in, 0.1969 in)- Overall length
1,150 mm
(45 in)- Overall width
800 mm
(31 in)- Height
1,700 mm
(67 in)- Weight
1,000 kg
(2,204.62 lb)
Description
Nanosecond laser is used for precise dicing of GPP wafers.
Product advantages:
• High processing quality
The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ 30 ± 5 μm) , small edge collapse ≤ 10 μm
• High processing efficiency
UPH ≥ 15 (take 40mil, 5-inch GPP wafer as an example, including automatic loading and unloading)
• Good processing stability
Nanosecond laser has high power stability and good beam quality (M ² < 1.5)
Catalogs
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Specialized Products for Semiconductor Industry
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.