Interconnect PALADIN®

DENSITY AND PERFORMANCE OPTIMIZED The Paladin® HD interconnect system provides world class bandwidth through industry leading density at 112GB/s performance, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin HD utilizes a balanced pair structure; built with individually assembled and discretely shielded differential pairs which have a revolutionary hybrid board attachment for maximized density. The mating interface is designed to optimize space and eliminate the traditional orthogonal "twist". Paladin HD utilizes a common mating interface between orientations and can support orthogonal and cable applications. World class bandwidth: 144 orthogonal pairs within 1RU at 112GB/s Industry leading transmission-to-crosstalk performance Revolutionary hybrid board attach allows for flexible board routing Impedance control over a 1.5mm connector de-mate Discretely shielded and balanced differential pairs Common mating interface World class orthogonal density Industry standard performance for 112G systems Linear transmission beyond 40GHz Hybrid board attachment with press fit grounds and compression mount signals allow for traditional manufacturing processes Maximized routing channels to minimize board layers Consistent Signal Integrity performance over the connector's mechanical mating range Mechanically matched and electrically balanced signals within each differential pair Common and symmetrical mating interface Leverages proven Paladin differential pair architecture and mating interface 92Ω nominal impedance +/- 5Ω