With multiple lifetime extension options and various security features for the wafer, the ViProbe®II brings all the advantages of the ViProbe® to the next level
Min. pitch of the DUT - 50 µm
Min. diameter of the plunger - 1,6 mil
Max. contact surface - 105 mm x 105 mm
Temperature - -55°C...+180°C
Current carrying capability at RT - 800 mA
Contact force at rec. OD - 2,4 cN - 10,8 cN
Material compatibilities -
Material compatibility 1 - Gold
Material compatibility 2 - Palladium
Material compatibility 3 - Diverse
Material compatibility 4 - Solder ball
Material compatibility 5 - Aluminium
Material compatibility 6 - Copper