- Machine-tools
- Finishing Machine
- Polishing finishing machine
- Feinschleif-, Läpp- und
Polishing finishing machine FLP Wafer 1700 nanoCNCfor micro-finishing applicationsindustrial
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Characteristics
- Associated function
- polishing
- Type
- CNC
- Applications
- industrial, for micro-finishing applications
- Treated material
- granite
- Other characteristics
- double-sided
- Rotational speed
Max.: 30 rpm
(188.5 rad.min-1)Min.: 3 rpm
(18.85 rad.min-1)
Description
FLP Microfinishing has developed its own CMP wafer polishing machine series for use in the semiconductor industry. The new FLP Wafer 1700 nano is a wafer double-sided polishing machine.
For the first time, chemically resistant granite polishing wheels are installed in this machine, which are continuously controlled via servo drives. They ensure a very high degree of accuracy of the tool finish.
In addition to silicon prime wafers, gallium arsenide, silicon carbide, sapphire and other substrates can also be processed.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.