video corpo

Polishing finishing machine FLP Wafer 1700 nano
CNCfor micro-finishing applicationsindustrial

polishing finishing machine
polishing finishing machine
Add to favorites
Compare this product
 

Characteristics

Associated function
polishing
Type
CNC
Applications
industrial, for micro-finishing applications
Treated material
granite
Other characteristics
double-sided
Rotational speed

Max.: 30 rpm
(188.5 rad.min-1)

Min.: 3 rpm
(18.85 rad.min-1)

Description

FLP Microfinishing has developed its own CMP wafer polishing machine series for use in the semiconductor industry. The new FLP Wafer 1700 nano is a wafer double-sided polishing machine. For the first time, chemically resistant granite polishing wheels are installed in this machine, which are continuously controlled via servo drives. They ensure a very high degree of accuracy of the tool finish. In addition to silicon prime wafers, gallium arsenide, silicon carbide, sapphire and other substrates can also be processed.

Catalogs

No catalogs are available for this product.

See all of Feinschleif-, Läpp- und‘s catalogs
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.