Flip-chip die bonder AL300

The machines of fi conTEC‘s 300 series are small footprint yet high precision die bonders. They are designed to break down complex assembly processes into standardized recurring sub-processes for low cost of ownership. Same as fully contained systems such as the 1000 or 2000 series the AL300 is build for industrial usage in production environments. Typical Tasks • Pick and place • Die sorting • Dispensing of adhesives • UV curing • Chip to chip bonding • Chip to package assembly ProcessControlMaster Powerful Machine and Process Software • Freely programmable machine processes • User friendly user interface • Line based process programming • Recipe based management of process parameters • Algorithms for active assembly • SQL data base based storage of process parameters and fl exible data import and export • Component tracking • Remote service and control via internet • Same software on all fi conTEC machines for consistent look and feel of machine programming and operation