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Finetech
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Finetech GmbH
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All Finetech products
Micro Assembly
sub-micron die bonder
FINEPLACER® femto 2
fully-automatic
automated
high-accuracy
fully-automatic die bonder
FINEPLACER® femto pro
eutectic
multi-chip for flip chip
for die-attach
automated die bonder
FINEPLACER® pico 2
high-accuracy
sub-micron die bonder
FINEPLACER® lambda 2
automated
high-accuracy
fully-automatic die bonder
FINEPLACER® sigma
sub-micron
high-accuracy
multi-chip for flip chip die bonder
FineXT 6003
automated
high-accuracy
Advanced Rework
BGA rework station
FINEPLACER® core plus
automatic rework station
FINEPLACER® pico rs
for SMD
Rework station
Die bonder
Automatic rework station
BGA rework station
High-accuracy die bonder
Automated die bonder
Flip-chip die bonder
SMD rework station
Epoxy die bonder
Die-attach die bonder
Fully-automatic die bonder
Eutectic die bonder
Micro assembly die bonder
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