BGA rework station FINEPLACER® coreplus

One for everything The FINEPLACER® coreplus is an all-round hot air rework station for electronic components and assemblies. The complete rework cycle, including desoldering and soldering the component, residual solder removal and reballing, can be performed on the same compact rework system. The spectrum of compatible surface-mount devices ranges from very small (01005) to large components (BGA). The full-area Bottom Heating Module has been optimized for reworking medium sized PCB of consumer electronics (tablets, laptops, gaming consoles) or medical technology products (i.e. MRT devices). A pre-installed profile library and an intuitive visual user experience enables new operators to pick up work immediately. Numerous professional features, such as digital top heater calibration, precision touchdown force control and live process observation, make the FINEPLACER® coreplus a future-proof investment when the demands get tougher. Highlights - Components from 0.125 mm x 0,125 mm to 90 mm x 90 mm - JEDEC/IPC conform thermal management with top and bottom heating systems - Automated pick-up and touch-down with force measuring - Automated processes - Process traceability with SmartIdent - Intuitive user experience with SmartControl - Compact machine design