Thickness measurement system MicroProf® MHU

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The FRT MicroProf® MHU metrology tool with Material Handling Unit, is specially designed for the semiconductor, MEMS, sapphire, and LED industries. Typical applications are measurements of bare and coated, as well as structured wafers at various lithographic process steps. Due to a robotic arm with two vacuum end effectors, the tool has very high throughput rates of up to 220 wafers per hour. It is capable of processing wafer sizes from 2 to 8 inches. Up to 4 open cassettes can be processed and, additionally, there is the option to integrate a pre-aligner and an OCR reader. The option for two-sided sample measurement allows the simultaneous measurement of the top and bottom surface with determination of the sample thickness, total thickness variation (TTV) and various surface parameters such as roughness, waviness and flatness of both sides. A complete wafer shape measurement is also possible with analysis of the global and local wafer parameters. A wafer sorting function is available, which is adjustable according to customer requirements. Based on SurfaceSens technology, additional sensors can be retrofitted later. A further application of the MicroProf MHU is the layer thickness determination of thin films, as well as layer stacks, measurement of step heights, bumps, vias (TSVs), trenches, etc.