Cleaning solvent

for etching residues

Cleaners Aqueous post ash residue cleaners on aluminum and copper alloys, anti-reflective layers, SiO2 and low-k dielectrics Highly effective aqueous post ash residue cleaners for both Al/SiO2 and Cu/low-k BEOL processes. Applications include removing etch residues at via, metal line, and bond pad levels on Al alloys, anti-reflective layers, and SiO2 dielectrics or etch residue removal in damascene processes with Cu, low-k and ultra-low-k compatibility. • Wide process latitude • Compatible with spray and batch tool applications • Compelling cost of ownership advantage over hydroxylamine (HA) solvent-based cleaners - Direct DI water rinse • Eliminates IPA rinsing chemical cost • Increased throughput by eliminating IPA-rinse steps • Safe and easy to use • Excellent process equipment materials compatibility • Superior metals and ILD compatibility • Packaging options: • 4 L HDPE bottle • 200 L drum • Removing etch residues at via, metal line, and bond pad levels on Al alloys, anti-reflective layers, and SiO2 dielectrics. • Etch residue removal in damascene processes with Cu, low-k and ultra low-k compatibility.