Semiconductor resin LTC 9300 Series

photosensitive

Fujifilm’s solvent developable polyimides are a family of photo-imageable polyimide precursors, covering both high and low cure temperatures for edistribution layer (RDL) and buffer coat applications. • Negative acting, solvent developable polyimides • Photo-imageable using g-line and/or i-line exposure tools • Low or high temperature cure options • Fast photospeed for high throughput • Excellent mechanical properties for high reliability • NMP free offerings for both high and low temperature cure Product Summary • LTC 9300 Series: Low temperature cure polyimides are photo-imageable polyimide precursors which are sensitive both in g- and i-line. They can therefore be imaged on all exposure tools. LTC 9300 series polyimides are ideally suited for redistribution layer applications for advanced packaging. • Durimide® 8300 Series: High temperature cure polyimides are photo-imageable polyimide precursors which are sensitive both in g- and i-line. They can therefore be imaged on all exposure tools. Durimide® 8300 series polyimides are ideally suited for buffer coat application in high reliability packages.