The basic principle of laser welding is accomplished through three processes: wetting, diffusion and metallurgy. After the solder is heated and melted, the solder joint is moistened and diffused to the solder joint with the inherent tension of the solder joint, and the metal layer of the solder joint is contacted to form an alloy layer, so that the two are firmly combined.
Laser soldering through preheating solder joint, solder supply heating, set heating three steps. Laser belongs to the "surface heat release", heating speed is very fast, can achieve high-precision spot welding, small heat-affected zone, small deformation, fast welding speed, smooth and beautiful welding, no need to deal with after welding, no splash, high welding quality, no porosity, accurate control, small focusing spot, high positioning accuracy, real-time monitoring and feedback of welding temperature, easy to achieve automation and large-scale operations.
* Fully automatic control, PC+QC software control, Windows 10 operating system.
* Semiconductor laser welding system, CCD visual positioning, precision tin wire feeding mechanism, double station table, electrical system, etc. The laser power is optional, and the temperature accuracy is plus or minus 2℃. Through the precise control of the temperature, the welding effect can be fully grasped and the welding parts can be avoided.
* Can access to shopfloor\MES system
* With the characteristics of high quality, high yield, high stability and no production consumables.