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- Fiber laser marking machine
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Fiber laser marking machine HDZ-SIC seriesCO2 laserUV lasermobile
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Characteristics
- Technique
- fiber laser, CO2 laser, UV laser
- Configuration
- mobile
- Applications
- for PCB, for wafers
- Other characteristics
- automatic, vision system
Description
Applicable for the packaged IC marking of DIP, QFN and BGA.
1. Fully-automatic loading and unloading from hanging basket to hanging basket, stable laser output, direction inspection function of intelligent vision system, sampling inspection function of marking effect
2. Friendly HMI
3. Imported double-head 20W fiber laser marking system; the green laser, UV laser, CO2 laser and other laser sources are optional
4. With special fume removal device, it can quickly extract the fume and dust produced during marking to protect the marking area environment
5. It complies with CE MARK and SEMI standard
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Other Han's Laser Technology Co., Ltd products
PCBA & IC & Wafer marking
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.