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Fiber laser marking machine HDZ-WAF600CO2 laserUV lasermobile
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Characteristics
- Technique
- fiber laser, CO2 laser, UV laser
- Configuration
- mobile
- Applications
- wafer
- Other characteristics
- automatic, air-cooled
- Power
7 W, 10 W, 20 W
(0.01 hp, 0.01 hp, 0.03 hp)
Description
Applicable for the 6-inch, 8-inch and 12-inch wafer marking
1. With the green laser or UV laser, the focusing spot is fine, and it is non-contact marking.
2. Fully-automatic loading and unloading, automatic edge searching, simple operation and high efficiency.
3. The whole system adopts computer control, Windows operation platform，interface in English, self-developed software, easy to operate.
4. With high automation, it has the function of automatic fault alarm.
5. Precise marking to the product DIE.
Other Han's Laser Technology Co., Ltd products
PCBA & IC & Wafer marking
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.