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Laser marking machine EP-IRPS-20ceramicglassmobile
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Characteristics
- Technique
- laser
- Material
- glass, ceramic
- Configuration
- mobile
- Applications
- for QR codes
- Other characteristics
- cutting
- Power
20 W
(0.03 hp)- Speed
7,000 mm/s
- Depth
0.1 mm
(0.004 in)
Description
1. Cutting and drilling of brittle materials such as glass, sapphire and ceramics.
2. LCD, OLED screen cutting (C, R, U angle cutting).
3. Ultra-precise Mark points on the glass material, fine invisible QR code (0.2mm) and other fine marks.
1. Good beam quality, small spot size for ultra-fine marking.
2. The heat affected zone is small, avoiding damage to the processed material and high yield.
3. Marking speed, high efficiency, high precision.
4. No consumables, low cost of use and maintenance.
5. The machine performance is stable, long-term operation.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.