Laser cutting machine MLC7200C4-A

for monocrystalline siliconfor processing industryhigh-efficiency

The dicing process used in the production of high-efficiency photovoltaic modules replaces the conventional laser dicing machine The core principle of non-destructive laser cutting is laser thermal stress controlled fracture technology, which uses laser to locally heat the material and produce a temperature gradient on the material surface, so as to induce the generation of thermal stress, and induce the stable fracture of the material through appropriate control of thermal stress. Non destructive laser cutting can realize low-temperature processing and avoid the ablation damage of solar cells. Main Features there is no laser thermal damage on the battery section and no laser thermal influence on the surface good mechanical performance and high conversion efficiency; maximum capacity ≥ 7200p / h, multiple configurations are optional; widely compatible with mainstream and new crystalline silicon battery products; ndependent intellectual property rights, multiple core patents.